--- In
Homebrew_PCBs@yahoogroups.com, "a3v03v0" <a3v03v0@...> wrote:
>
> Plugging holes is an add on to plated through holes. As far as I know
> all commercial processes seed and plate holes.
>
> I do toner transfer. apply solder paste with a stencil, and reflow in a
> fry pan (ala sparkfun). I am just starting to use TQFP and need vias
> under the chip. If I solder wires in the vias I do not think I can use
> the fry pan to reflow.
Maybe and maybe not, I've used a toaster oven to do reflow on TQFP packages and haven't had any trouble. (I got a toaster oven at a local thrift store for $7)
In my opinion, as long as you get the wire/vias as flush as possible to the PCB under the TQFP package so that the pins rest against the pads of the PCB, you should be ok!
>
> The hope is that I can metalize the walls of the vias with the pen and
> heat cure. The apply solder paste into the vias using a stencil that
> has both SMD pads and vias.
>
I think you are on to something here, and if you get good results, please let us know, because I too would like to experiment with this method.
> Note that the pen is marketed to make and repair traces. This falls
> outside of that intended use.
Diesel engines are meant to burn diesel, but apparently you can still burn vegetable oil or peanut oil in them (with modification of course).
Why not try something new with something meant for something else?
I wish you good luck and much fun with your experimentations!
Daniel
>
> 3v0
>
>
>
> --- In Homebrew_PCBs@yahoogroups.com, DJ Delorie <dj@> wrote:
> >
> >
> > "leon Heller" leon355@ writes:
> > > But it's just a single stage, not several stages as was claimed.
> >
> > Are we reading the same page? They don't describe their plating
> > process at all on that page, just that they plate the vias before
> > filling, then plate over them afterwards. I would assume that the
> > plating processes are the same regardless of whether you're going to
> > fill the hole or not.
> >
>