I have found problems with using 30AWG wire and the pin method, I even tried using 10mil trace repair kits. The solder mound is kinda big. I am using an AVR mega8 QFP so there isnt much room. But I was able to redesign the board to remove the vias under the Quad.
Brian
--- In Homebrew_PCBs@yahoogroups.com, "javaguy11111" <javaguy11111@...> wrote:
>
> I have used 30 gauge wire under components. My procedure is
>
> 1. Drill via holes just slightly larger than the wire size. I can not
> remember which drill number it was. Ideally you want a little resistance
> when inserting the wire.
> 2. Scotch tape the corners of the board. This elevates the board
> a few thousands.
> 3. From the back side of the board insert wire into via so that it touches
> the table underneath. It should protrude slightly above the surface.
> because of step one.
> 4. Solder wire the board.
> 5. Cut wire.
> 6. Repeat for all holes.
> 7. Flip board over and apply flux and solder paste to wires.
> 8 Reflow solder in toaster oven.
> 9 Verify continuity and that components clear the vias.
>
>
>
>
> --- In Homebrew_PCBs@yahoogroups.com, "Brian" <blue_eagle74@> wrote:
> >
> > I have made double sided boards. I have tried 30 AWG wire, to big for putting under componets and flat wire from trace repair kits. The problem I am having is solder buildup. I have tried solder wicking but leaves less than desired amounts of solder. I have even used replacement eyelets but either they are too long or the pad area is to big and/or wide to put under componets.
> >
> > What have you used that works, besides through hole plating?
> >
> > Brian
> >
>