On Wed, 06 May 2009 03:10:50 -0000, you wrote:
>I have made double sided boards. I have tried 30 AWG wire, to big for putting under componets and flat wire from trace repair kits. The problem I am having is solder buildup. I have tried solder wicking but leaves less than desired amounts of solder. I have even used replacement eyelets but either they are too long or the pad area is to big and/or wide to put under componets.
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>What have you used that works, besides through hole plating?
I don't have a really satisfactory solution. For one, I avoid vias
under components unless they're DIPS in sockets. That works for me.
If I'm paranoid, I make sure that there is continuity before I put the
socket on. I do avoid them, as well.
For vias, I have used either pins or eyelets. The eyelets I use need
a 0.051 hole and are rather large. They will work only on a 1/16th
inch board. I usually have a rule where the via is only a via, there
are no parts leads used to connect layers, and there are as few as
possible, and under parts is as avoidable as possible.
The problem with the pins is that they stick up even more, although
they have a somewhat (0.039) smaller hole. I can't recommend them and
my source has pretty much dried up. Eyelets are cheaper, besides.
I've heard that others have used #30 wire, stitching between holes and
trimming the wires off. That might work, but you still have the
solder blobs.
So in summary, no real good solution, but I can get some decent boards
done, just not as nice as plated through holes. Eagle, BTW, is not
optimized for this kind of design, but with a little persuasion, I can
get it to work.
Harvey
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>Brian
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