I don't think mine is so conductive - I hope not.
I can't imagine how anything can get the crud out from under a QFN
package. Even a BGA seems relatively easy by comparision. Basically
any component that sits flush against the board would seem pretty much
impossible to me.... (Obviously there ought to be ways that I can't
think of).
ST
On Sat, May 2, 2009 at 5:40 PM, DJ Delorie <dj@...> wrote:
>
> You folks aren't making this easy for me... ;-)
>
> One thing I noticed about my current no-clean is that the residue has
> (relatively) low resistance. If I have a 25 mil gap between power and
> ground, an inch of that results in 330k between them. I end up
> scraping between traces to get the hardened residue off.
>
> I wonder if a waterpik would be enough to get those hard-to-reach
> places that make people avoid water soluble flux? I do have some QFNs
> in my current project...
>