>Does anyone have any guidelines for
>volume of solder paste for various size ic contacts?
This would be commercial stencil thickness x the area of the SMD pad.
You can calculate pad areas from data sheets. In your case it would be
stencil thickness x pi x r^2 where r (half the diameter) would be the
radius of your drilled hole.
You can see that if your drilled stencil thickness is slightly greater
than that of a commercial stencil then this would compensate for
smaller circle area. That's the theory but in practice the solder paste
volume isn't all that critical. Don't waste your time trying to be too
exact.
http://www.pbase.com/eldata/stencils --- In Homebrew_PCBs@yahoogroups.com, Mark Lerman <mlerman@...> wrote:
>