Archive of the former Yahoo!Groups mailing list: Homebrew PCBs

Hi all.

Well I managed to get a translation of the process. Here is what I
have received. I do not know how good the translation is but here it is.

Trev

Through Holes production process
1. Nickel-plated agent modulation
2. Glue fixing straps

Tools
Etching Tank x 1
Thermometer x 1
Heating Pipe x 1
Nickle-plated agent x 2
Fixing straps x 4
Double sided tape x 4

1. Nickel-plated agent modulation
Hold the etching tank with 1 hand and bottle with the other
Pour the chemical slowly (from sideway) into tank - to avoid spatter
When nearly done, change to the normal direction & pour in the remaining
Put the heating pipe into tank (centre) and afixed it to the side
Heating pipe set at approx. 55 degree celcius (50 - 60 degree celcius)
Then plug in the thermometer & oxygen tube
Note - put the standby power supply before putting the heating pipe
power on
Stick the double side tape onto fixing straps

First step - Anti-plating
Purpose - to apply a layer of anti-plating coating on electronic board
a. Unstrap the double-sided tape paper on fixing strap
b. Stick it onto blank paper
c. put the electronic board next to the fixing straps
d. unstrap the other double sided tape paper on fixing strap
e. stick it on the next to the electronic board
Note - Please do not touch the board surface with hand
f. Use anti-plating pen and smear over (from left to right) the board
g. Gently & intermedia speed, in order the whole board is coated with
the anti-plating
h. Needs to apply each coating strap 3 times
i. There is some overlapping between first and second strap, so on and
so fort
Note - Please do not touch the board surface until the coating is 100%
dried up
j. Use hair dyer to dry the coating, without touching the board
surface, takes about 3 mins
k. Take another piece of blank paper and 2 fixing straps, repeat the
same for the other side of the board
l. Repeat the coating on the other side of the board
m. Repeat the drying process

Second Step - Drilling
Note - MUST use the PCB specialise Tungsten/ Wolfram steel drilling needle


Chemical Process
First step - Surface treatment
Purpose - Clean the holes to enhance the plating effect
Time - 3mins (2-4mins)
a. Put 2-3cc surface treatment agent onto board
b. Use brush to apply the agent all over the board surface
c. Use fingers to press on board, make sure liquid has get thru all holes
d. repeat the above for about 3mins, to make sure liquid has get thru
all holes thoroughly
e. Clean brush, container and board with water
f. Fling the brush, container and board till dry

Second Step - Activation
Purpose - To coat the board surface and inner holes with activator agent
Time - 3mins (2-4mins)
a. Put 1-2cc activator agent onto board
b. Use brush to apply the agent all over the board surface
c. Use fingers to press on board, make sure liquid has get thru all holes
d. repeat the above for about 3mins, to make sure liquid has get thru
all holes thoroughly
e. Clean brush, container and board with water
f. Fling the brush, container and board till dry

Step Three - Coat stripping
Purpose - To clear out anti-plating coating
Time - 3mins (2-4mins)
a. Put 2-3cc coat stripping agent onto board
b. Use brush to apply the agent all over the board surface
c. Use fingers to press on board, make sure liquid has get thru all holes
d. repeat the above for about 3mins, to make sure liquid has get thru
all holes thoroughly
e. Clean brush, container and board with water
f. Fling the brush, container and board till dry

Step Four - Pre-plating Treatment
Purpose - Copper Foil pre-plating treatment
Time - 3mins (2-4mins)
a. Put 2-3cc pre-plating treatment agent onto board, this would change
the colour of copper foil if it is working
b. Use brush to apply the agent all over the board surface
c. Use fingers to press on board, make sure liquid has get thru all holes
d. repeat the above for about 3mins, to make sure liquid has get thru
all holes thoroughly
e. Clean brush, container and board with water
f. Fling the brush, container and board till dry
g. If unable to place the board into etching tank within the next 20
second, please soak the board in container filled with water, to avoid
contact to the air

Step Five - Nickel Plating
Purpose - to plate electric conductive metal onto holes and copper foil
Time - approx 30min to an hour (the longer time, the thicker coat)
a. When temperature reaches 55 degree celcius, put the board into
etching tank (filled up with nickel-plated agent)
b. Needs approx. 30mins
c. Should have tiny bubble raising in the nickel-plated agent
d. Upon completion, u are able to see holes are coated with nickel.