With a negative film, this sounds more like under-exposure.
Have you tried increasing exposure time ?
--- On Mon, 10/20/08, lcdpublishing <lcdpublishing@...> wrote:
From: lcdpublishing <lcdpublishing@...>
Subject: [Homebrew_PCBs] Dry film- negative resist... First attempt failure
To: Homebrew_PCBs@yahoogroups.com
Date: Monday, October 20, 2008, 3:19 PM
Hi guys,
I tried my first photo process board this weekend and the process
failed completely. I am using the dry film, negative resist from MG
chemicals.
The failure was in the developing of the resist. While developing,
all the resist washed off. It was developed as I could see the
traces in the resist, but faintly.
The developer solution was a best guess on dilution so this is
probably my main failure point.
I am wondering what actually holds the resist to the board though.
Per the instructions, I am suppose to peel off the backing, apply
resist to the board and then run it through a laminator twice. Is
this what causes the dry film to stick to the board or is it the
exposure process?
I also suspect that using vellum for the artwork is not a good
thing. Using some scraps, I noticed that exposure is much different
using transparncy than vellum. So my next attempt will be using
transparencies and to carefully measure the developer.
Chris
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