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Subject: "How to succeed the first time with ultra-small QFN packages"
From:
Matthew Smith <matt@...>
Date:
2008-06-05
Hi Folks
I know that under-chip pads were mentioned recently, so I thought that I
would pass on this link from the TimeNuts mailing list:
Article:
"How to succeed the first time with ultra-small QFN packages"
<
http://www.wirelessnetdesignline.com/showArticle.jhtml?articleID=202800018
>
Whilst the article describes the use of a solder stencil, I am sure that
this technique could be reproduced manually, given good magnification
and a steady hand.
Then all ready for the toaster oven or hotplate!
Cheers
M
--
Matthew Smith
Smiffytech - Technology Consulting & Web Application Development
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