I have done it in one trip to the oven because I was concerned with
the effects of heating the board and components twice. My little
toaster over isn't that great.
--- In
Homebrew_PCBs@yahoogroups.com, Markus Zingg <homebrew-pcb@...>
wrote:
>
> If I have components on both sides, I just do the simpler side first,
> reflow it, then do the other side. No part ever felt off so far. I've
> not yet been brave enough to populate both sides and do it in one
> shot.... :-) Nice to hear that this would be an option also. I prefer
> the two step aproach cause you then don't have to be THAT carefull with
> not disturbing the already populated but not yet reflowed side.
>
> Markus
>
> eeks123 schrieb:
> >
> >
> > > Tacky enough that I have populated boards on both sides at the same
> > > time then stuck in the oven. The parts that went on the bottom side
> > > were smaller items like 0402 chip capacitors, but they did not go
> > > anywhere.
> > >
> > > Of course if you do that you will need to add feet to the board
so it
> > > is not resting on the bottom.
> > >
> >
> > amazing! when solderpaste gets liquid components should drop.. that's
> > a question i was making myself, is it possible to populate components
> > on both sides when reflow-soldering? i thought you had to hand-solder
> > components on the second side, if not, bad things would happen..
> >
> >
>