If I have components on both sides, I just do the simpler side first,
reflow it, then do the other side. No part ever felt off so far. I've
not yet been brave enough to populate both sides and do it in one
shot.... :-) Nice to hear that this would be an option also. I prefer
the two step aproach cause you then don't have to be THAT carefull with
not disturbing the already populated but not yet reflowed side.
Markus
eeks123 schrieb:
>
>
> > Tacky enough that I have populated boards on both sides at the same
> > time then stuck in the oven. The parts that went on the bottom side
> > were smaller items like 0402 chip capacitors, but they did not go
> > anywhere.
> >
> > Of course if you do that you will need to add feet to the board so it
> > is not resting on the bottom.
> >
>
> amazing! when solderpaste gets liquid components should drop.. that's
> a question i was making myself, is it possible to populate components
> on both sides when reflow-soldering? i thought you had to hand-solder
> components on the second side, if not, bad things would happen..
>
>