> Basically that is the idea, yes. But if you reflow with hot air
> instead of an oven this doesn't always work perfectly. Some part
> shapes tend to be pushed around by the air, like MELF diodes.
yes, air flow and small components are apparently a bad combination. i
suppose it's a try-and-try-again until you learn which distance is
best, taking care where you point with the gun at, how much time a
component can be exposed to that temperature, etc. you can solder a
lot faster than with an oven, but you need to learn how to work with
it. plus chances to damage something seem to be higher, when
learning/starting
> It also depends on the solderpaste used, some stays in shape when hot
> and some melts and forms large puddles on which the components swim
> around.
i didn't knew there are two types, i supposed all components would
swim, and that was also a reason to use soldermask -to avoid
solderpaste flowing away through tracks-. so the first one is better
but has a shorter shelf-life :( how do you know which type of
solderpaste you are buying? through composition?
> But you still need to observe some layout considerations for parts to
> stay put. Always think surface tension.
i've seen this explained on a webpage, it's important the way tracks
go to the component, and also if there any very near to it.
regards