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Subject: Re: [Homebrew_PCBs] Re: BGA Soldering: Hot air rework station

From: "Leon" <leon355@...>
Date: 2007-10-04

----- Original Message -----
From: "Andrew" <andrewm1973@...>
To: <Homebrew_PCBs@yahoogroups.com>
Sent: Thursday, October 04, 2007 2:48 AM
Subject: [Homebrew_PCBs] Re: BGA Soldering: Hot air rework station


>> Leon wrote:
>> <SNIP>
>> but they were Telit GSM/GPS modules
>> without real solder balls and they
>> needed to get a mini-stencil made,
>> which was rather expensive.
>
> Leon, was it the 863 or the 864 ?
>
> If it was the 864 - how hobbiest
> frinedly would you say they are ?
> (The 863 doesnt look too scarey)

GE863. As I said, it doesn't actually have solder balls, which means that it
needs solder paste and a stencil. It's actually a lot harder to use than
real BGAs.

Leon