>unfortunately the parts I am describing have a heat slug under the
>part and are designed to be soldered to the PCB.
If I followed the datasheet for the heatsinked component in the shot
then there would have to be 24 vias connecting the bottom 8 sq. cm
pad to the top 3 sq. cm pad to which the slug is soldered.
>Once the parts are soldered down, there is no access to the heat
>tab, thermal dissapation is only thru the PCB.
The case is always a viable means of heat dissipation, albeit with
higher junction-to-whatever thermal resistance. Couple the case to a
suitable heatsink and your junction-to-ambient resistance can be more
than suitable.
--- In
Homebrew_PCBs@yahoogroups.com, "Dave Miller" <dmiller45@...>
wrote:
>
> --- In Homebrew_PCBs@yahoogroups.com, "derekhawkins" <eldata@>
wrote:
> >
> > >Has any one else had to use similar parts? How have you managed
to
> get
> > >the heat out of these parts? Any other suggestions?
> >
> > Double sided thermal tape (or thermal epoxy) and heatsink.
> >
> > http://www.pbase.com/eldata/image/66582088
> >
> >
> > --- In Homebrew_PCBs@yahoogroups.com, "Dave Miller" <dmiller45@>
> > wrote:
> > >
> >
>
> Thanks Derek, the method you describes works great for parts where
you
> have access to the heat tabs, unfortunately the parts I am
describing
> have a heat slug under the part and are designed to be soldered to
the
> PCB. Once the parts are soldered down, there is no access to the
heat
> tab, thermal dissapation is only thru the PCB.
>