i think all processes are capable of providing nearly the same results if used properly.
the one thing is the resist, it must be suited for the etchant.
the second, underetching under the resist, can be prevented if the process is used the right way.
i think if all is right (aeriation if needed, stirring, heating) and all is set up to result in a even
etch over the whole board there is nearly no under-etching.
i think the most of the listed processes are also used in professional setups(some more often, some
less).
therefore they all should be suitable to provide perfect results.
i think for setting up a etch it is important to consider the following:
availability of the chemicals.
disposal regulations / possibilities.
required speed.
available room.
time you want to invest, money you want to invest.
very important: number of pcbs per time unit you want.
ability to build etching compartments (more complicated with spraying/aeration)
you can use methods which need virtually no preparation/maintainance but also need more time/money when
actually making a pcb. but in methods like cucl you have to prepare the etch quite a time before and
also you need time for regeneration etc.
if you really want to make pcbs in your garage you have to read descriptions for all methods.
you have to look at your stores what you can get easily. only then you can decide.
you will soon find arguments against the one or other method.
regards
st
22.05.2003 18:20:36, Neil <
cobra_neil@...> wrote:
>Hi Marty,
>
>Interesting info. Thanks.
>
>Would you have any info relating to how clean the final etch is, and what
>minimum traces can be obtained by each of the options you mentioned. I've
>traditionally used FeCl, but just picked up some Ammonium Persulphate (MG
>Brand) but haven't tried it yet. Also, the ammonium fumes may be a problem
>so I'm not trying to get as much info as possible before I actually try it.
>
>Cheers,
>-Neil.
>
>
>On Thursday 22 May 2003 10:23, Marty Grove scribbled:
>> <lots o' stuff>
>
>
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