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Subject: Re: [Homebrew_PCBs] liquid tin as mask?

From: DJ Delorie <dj@...>
Date: 2007-04-12

guja <guja2001bg@...> writes:
> II electroplating: exposed copper surfaces (vias, thrupads, traces) with tin

Can the "liquid tin" chemical dip be used instead of electroplating?

> FeCl or HCl based etchant will remove both copper and tin, thus unsuitable.

Bummer.