1)
I electroplating: (prepared) vias with copper and (exposed) traces with more copper.
II electroplating: exposed copper surfaces (vias, thrupads, traces) with tin
2) removing resist.
3) than etching, which removes bare copper.
(ultrashort description due to my bad english, sorry)
FeCl or HCl based etchant will remove both copper and tin, thus unsuitable.
DJ Delorie <
dj@...> wrote:
guja <
guja2001bg@...> writes:
> tin-ELECTROplated-mask is suitable (only) for ammonium-persulfate-etching.
So, this idea is no good with FeCl, or with "liquid tin"?
That kinda limits it.
But I suppose if you can electroplate a via, you can electroplate the
tin too.
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