In a message dated 5/9/2003 6:39:23 PM Central Standard Time,
m.zingg@... writes:
> One of the bigger obstacles when it comes to through hole plating
> (IMHO of course) is getting the right chemicals.
Markus!
Please let us know what those "right chemicals" are, and how to apply them!
(Temperature? catalysts? time in bath? USW!)
Then, what current (Strom, Amperes) per 0.1 m^2 to plate-through!
But remember! The plating-through is done BEFORE etching!
Thanks! Jan Rowland
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