On Sun, 03 Sep 2006 17:36:39 +0200, jdizzlemynizzal
<
jdizzlemynizzal@...> wrote:
>
> What is the procedure in Hot Air Reflowing?
You apply solder and flux in some form, usually a paste with small solder
particles in it, but in a pinch you can also simply tin one or both
surfaces. Then you position the component close to where it should end up.
Next you re-flow the solder by melting it in some way (therefore the
name), with hot air, an oven, a hotplate, or even infrared light.
This forms nice solder joints almost magically, surface tension making
sure the solder goes where it is wanted and the parts align properly.
Then you let things cool, clean of the flux if needed, and you are done.
The really big advantage is undoubtedly that it is very efficient if you
have many components, but with SMD it is also the most convenient way to
do rework etc..
ST