For the fine pitch packages I am soldering one corner
of chip and then doing fine alignment by checking
opposite corner. If it is ok then I am soldering this
corner also. As a next step I am using to much solder
for all pins and short circuiting all pins of the chip
by solder, after than I am removing excess solder by
solder wick. I am also checking shorts by magnifier
and then I am cleaning the board by acetone or
alcohol. By this method I could be able to solder down
to 0.35mm fine pitch SMD components.
Volkan
--- jdizzlemynizzal <
jdizzlemynizzal@...> wrote:
> A datasheet that includes footprints and dimensions
> for the US8
> package,
> http://www.fairchildsemi.com/ds/NC/NC7WZ08.pdf ,
> this is
> incredibly small, its basically about the size of an
> SOT-23 but with 8
> pins. Some tips on soldering laughably small SMD
> components like the
> US8 would be appreciated.
>
>
>
>
>