On Fri, 25 Aug 2006 17:27:52 +0200, Robert Hedan
<
robert.hedan@...> wrote:
>
> The part that boggles me is how they get the traces down to the inner
> layers
> once it's all assembled.
> Complete/partial depth holes and then lining with conductive material
> like a
> normal via?
> So you'd have 2 via steps; one for each PCB, and then a final one for the
> assembled unit.
> Robert
>
As i say, google knows ;-)
Of course you can also make it in two steps if you need buried vias.
Remember - everything you can imagine- someone else is doing it already!
<
http://brl.ee.washington.edu/Education/EE498/notes/lec_pcb_mlv.pdf#search=%22multi-layer%20PCBs%22>
ST