--- derekhawkins <
eldata@...> wrote:
> >the trick is to 'remove' the used etchant off the surface of the
> >board as fast as it eats through the copper, really impressive. well
> >that's what the bubbles are for, but mechanically wiping is even
> >more effective!
>
> While that's the theory, I'm inclined to believe that the better bubble
> etchers also use the bubbles to move the board away from used etchant.
> In other words the board should be in constant motion ...
no reason to move anything!
when the etchant 'dissolves' some copper, it stays there and avoids further
reaction. the trick is to 'remove' this byproduct off the surface and allow
fresh etchant to reach the copper.
how you best do it is your 'method': bubble it, let density and gravity work,
spray it, wipe it off or whatever pleases you...
my experience (not theory) is to wipe and literally 'see' how the copper
disappears.
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