Hi Leon,
>I've just made another PCB with a footprint for a Hirose 50 way DF12
>connector with 0.5 mm lead spacing, it turned out very well. The DF12
>pads are 0.38x1.00 mm.
>
>
That's very impressive! It's pretty much what I'm aiming for, but I just
can't seem to get my process right. It's good to see some results in
context: I often find that people advocating one method or another
without revealing the level of complexity (principally trace and space
width) that they're attempting.
I'd like to be able to make double-sided boards with 8/8 traces and
spaces but this seems problematic. I'd be interested to hear from anyone
who's done this! My two biggest problems are contamination of the board
while handling it between stages of the process, and alignment between
the two layers. I need aligment errors of less than 1mm, and I'm not
sure that this is achievable in a DIY set-up. At the moment I drill
guide holes before exposure and use PCB pins to tack each side of
artwork in place, in turn, before taping the artwork to the board and
placing it in my UV box.
Stuart