> -----Message d'origine-----
> De : Homebrew_PCBs@yahoogroups.com
> [mailto:Homebrew_PCBs@yahoogroups.com] De la part de William Carr
> Envoyé : mai 21 2006 22:32
> À : Homebrew_PCBs@yahoogroups.com
> Objet : Re: [Homebrew_PCBs] Re: Alternate solvent inks
>
>
>
> You'd need to at least clean off the contact areas.
>
> I was envisoning cleaning the board, popping hot glue dots on the
> contact points, then spraypainting the board.
>
> Afterward the glue dots will likely pop off leaving clean copper.
Hmmm, hot glue, I hadn't thought of that. I don't think hot glue adheres
well enough to rip a contact pad from the epoxy.
One very slight problem using hot glue is that annoying thin string of glue,
it's very hard to make a clean 'drop'. I suppose it would be easy to break
off any interconnecting strings once the glue cooled.
The main problem for me would be the shape of the pads. I'm using SMD now
and the pads are rectangular, not round. If I was still using through-hole
components I'd give it a try. But it would drive me nuts having a round
shape over a square pad, I couldn't stand it.
Robert
:D