--- In
Homebrew_PCBs@yahoogroups.com, "Stefan Trethan"
<stefan_trethan@...> wrote:
>
> On Mon, 15 May 2006 09:30:56 +0200, Lez <lez.briddon@...> wrote:
>
> >
> >>
> >> But I wasn't pleased with how it looked. There was too much
solder
> >> blobbed up on most of the board (some parts were OK...just at
the
> >> edges...where I had probably accidently laid down less.) So I
tried
> >> Stefan's suggested method for removing the excess. With a paper
> >> towel. Except, it didn't really want to come off. I used a
slightly
> >> damp paper towel, btw. I shot the board again with the hot air
gun -
> >> just before applying the towel. I suspect the wet towel might
have
> >> cooled the board, I mean the solder, off too quickly, so it
froze in
> >> place, instead of wiping aside.
>
>
> You heated too much. The strange thin layer happens before the
paste
> reflows.
> I don't know how this works though.
>
> ST
>
That makes sense.
I should have read your instructions more carefully.
Thanks.
Jim
P.S. For now, I will have to come up with some sort of hard squeegee
and scrap away the excess solder (now minus any flux). I hope I
don't pull up a trace. I will try my technique out on one of the
ample ground planes I have in place....before I try it on the traces
and pads.