On Mon, 15 May 2006 09:30:56 +0200, Lez <
lez.briddon@...> wrote:
>
>>
>> But I wasn't pleased with how it looked. There was too much solder
>> blobbed up on most of the board (some parts were OK...just at the
>> edges...where I had probably accidently laid down less.) So I tried
>> Stefan's suggested method for removing the excess. With a paper
>> towel. Except, it didn't really want to come off. I used a slightly
>> damp paper towel, btw. I shot the board again with the hot air gun -
>> just before applying the towel. I suspect the wet towel might have
>> cooled the board, I mean the solder, off too quickly, so it froze in
>> place, instead of wiping aside.
You heated too much. The strange thin layer happens before the paste
reflows.
I don't know how this works though.
ST