Wow, you have been hard at work. Congratulations on your findings.
I just bought a new Grade B burette on the weekend and it shipped
today <g>. (I had decided to put off procrastinating . . .)
So - to start out, if I get this right, I can prepare a solution of
0.1 to 0.5 Moles/liter (0.4% to 1.6% w/v HCl) and start etching?
Grant
--- In
Homebrew_PCBs@yahoogroups.com, Adam Seychell
<adam_seychell@y...> wrote:
> I found that higher copper gives faster etch. Currently I get
> around 15 minutes etch time at 20°C for 35 um copper, bubble
> agitation with a solution composed of 160 grams/liter copper and
> about 0.2 moles/liter of HCl acid, the specific gravity at 20°C
> is 1.280.