On Sat, 13 May 2006 12:41:51 +0200, mycroft2152 <
mycroft2152@...>
wrote:
> Stefan seems closest. He is at least applying the MIS ink to
> copperclad. Since he is having a banding problem, related to the
> printhead, it mght be appropriate for him to "shift gears"and develop
> the drying / curing process even with the striped boards. We would be
> that much further ahead, when the printhead problem is solved
> TANSTAAFL!
> Myc
Actually, the curing is easy.
I just put it on the stove plate and wait till i see the ink discoloring
slightly.
Then it seems to hold up well in CuCl.
I didn't dry them at all in air.
Layer thickness is apparently an important factor, that's why i have
suspended any work on curing until i have a printer that can "do it".
The first sample i tried before i had the printer i painted with a
toothpick, but even after a few days air drying it was washed clean away
in the etchant within seconds.
If you heat the PCB it will resist. I think somehow the water is all
evaporated with the stove, if you air-dry it a small amount remains and
makes it water soluble.
I think later i will use a oven with temperature control, which i also
will use for SMD soldering (but have yet to build it). This will allow
baking the second side without damage to the first one against a hotplate.
ST