On Mon, 27 Mar 2006 17:50:06 +0200, matt clement <
buckeyes1997@...>
wrote:
> I saw a process used by a fab house and they used a negative photo
>
> resist and then tin coated the board. The tin only stuck to the
>
> places that had the bare copper. Then the board was chemically etched
>
> and the tin protects the copper. Would we possibly be able to come up
>
> with a similar system of printing a negative image and then tin
>
> plating before etching? The toner would probably melt when you tried
>
> to tin the board with an iron, but maybe a chemical plating process?
>
>
> Does anyone know for sure if tin etches away with FeCl? I might have
>
> to try it at lunch...haha.
>
>
> matt
>
I'm not sure about FeCl, those tin resist baths are usually Sulphuric acid
/ peroxyde i think.
You could do things that way, but why do you want to?
ST