On Fri, 18 Nov 2005 11:05:53 +0100, Mike Young <
mikewhy@...>
wrote:
>
> Now he tells me. What a pain the arse ∗that∗ is. I just reworked a DS
>
> board to single side, and got it down to "only" 10 jumpers.
>
>
> Speaking of vias, a few of them ended up under the chips. The SO packages
>
> barely make it, with a standoff height of 4 mils. I have one more SSOP
>
> package to glue on, due here tomorrow. I'm expecting trouble with that
> one.
>
> The spec says only 2 mils available underneath. Any advice? It's not
> just a
>
> via any more; it's a jumper now in a 24 mil hole on a SS board.
>
>
> I think it's time for the heat gun; start over.
my advice is:
avoid it! ;-)
if there's space, lift the trace, drill a larger hole where it was, bend
it down into it and solder in there.
I've had to connect to the exposed pad to heatsink a flat component
recently, and i drilled a larger hole and filled with solder. Surface
tension is not your friend here, i think some stranded wire pieces stuck
into the hole might have made it easier.
ST