Archive of the former Yahoo!Groups mailing list: Homebrew PCBs

Many of the traces for through hole parts end up on the top layer. Without
hole plating, there doesn't seem enough capillary action to draw solder from
the bottom pad to the top. Some of the leads will be unreachable, or at
least inconvenient to get to. A small dab of solder paste on top might do
it. Does the lead move enough heat to reflow the paste? Golly, but this
seems more complicated than it needs to be.

Also, the pads don't seem to take solder very well. I cleaned the board with
the Goof-Off that Pulsar included with the kit. It has a slightly oily
feel... Is this the problem? Will Tinnit improve matters?

Mike.