Steve wrote:
>
>
> There is also ChipQuik. Melt ChipQuik onto the existing solder, and
> the parts almost fall out. Basic idea is that it is an alloy that is
> very soft. Clean it all off before soldering the parts back in.
>
> http://www.chipquik.com
>
> I got a sample but haven't had a chance to try it out yet.
>
> Steve Greenfield
>
Interesting. Although their web site has no mention of application to
through hole components.
For SO8 and bigger you just need to get some 2mm diameter solid copper
wire, and bend to shape so it fits perimeter of IC pads (I extend the
wire out to make a small handle). Put soldering iron tip on the wire,
heat, apply extra solder between pads and 2mm wire, and soon the IC just
falls off. Do this all the time for TQFP, SO8, SO16 and the like. And
zero collateral damage if your careful.
Adam Seychell