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Subject: Re: [Homebrew_PCBs] Regenerating CuCl

From: Adam Seychell <a_seychell@...>
Date: 2005-09-02

johnwhitneyfiat wrote:
> I have been off the group for a while and I'm sure this was covered.
> In the direction for making etchant from Hydrogen Peroxide and Muratic
> Acid, it says that you can regenerate with a bubbler. How long does
> this take? I know it will depend on the amount and the area that was
> etched, but is there a rule of thumb to make it work. I do have to day
> that I make a small bathch and it worked great on a sample board.
>


Many factors involved, it could be 15 minutes or 2 days. Obviously the
more air that contacts the solution the quicker all the Cu(1+) converts
to Cu(2+). So more air, and smaller bubbles are two factors you can
control to increase speed. My etching solution seems to foam a little,
which ∗dramatically∗ increases the regeneration speed. Maybe add a drop
of dishwashing detergent ?
If your doing air regeneration, then make sure fee HCl concentration is
> 1 Molar or 5% wt, and specific gravity is above 1.30 , which
corresponds to about 140 grams/liter of dissolved copper. Having less of
these two parameters and you compromise etch speed.