<div dir="auto">I think you'd only have space for vias under the large pads. The smaller pads look to be too-fine pitched to allow vias underneath.</div><br><div class="gmail_quote"><div dir="ltr" class="gmail_attr">On Fri, 18 Feb 2022, 19:16 Mike Bryant, <<a href="mailto:mbryant@futurehorizons.com">mbryant@futurehorizons.com</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0 0 0 .8ex;border-left:1px #ccc solid;padding-left:1ex">
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<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1f497d">Hmm<u></u><u></u></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1f497d"><u></u> <u></u></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1f497d">I wonder if I put a via right under every pad (and lots under the large pads) I could flow solder through it ?<u></u><u></u></span></p>
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<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1f497d"><u></u> <u></u></span></p>
<p class="MsoNormal"><b><span lang="EN-US" style="font-size:10.0pt;font-family:"Tahoma","sans-serif"">From:</span></b><span lang="EN-US" style="font-size:10.0pt;font-family:"Tahoma","sans-serif""> The SynthiMuse [mailto:<a href="mailto:synthimuse@gmail.com" target="_blank" rel="noreferrer">synthimuse@gmail.com</a>]
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<b>Sent:</b> 18 February 2022 18:56<br>
<b>To:</b> Roman<br>
<b>Cc:</b> synth-diy@synth-diy org; Mike Bryant<br>
<b>Subject:</b> Re: [sdiy] ODP: Question for the self-assembly SMD-ers here<u></u><u></u></span></p>
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<p class="MsoNormal">Not sure what the footprint guidelines for this part are but I would arrange my footprint to have a few vias under the large pads and plan to apply hot air from below to flow solder paste on to all the pads. <u></u><u></u></p>
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<p class="MsoNormal">Gerry<u></u><u></u></p>
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<p class="MsoNormal"><u></u> <u></u></p>
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<p class="MsoNormal">On Fri, 18 Feb 2022, 18:47 Roman, <<a href="mailto:modular@go2.pl" target="_blank" rel="noreferrer">modular@go2.pl</a>> wrote:<u></u><u></u></p>
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<p style="margin:0cm;margin-bottom:.0001pt">Yes, it is doable with soldering iron. Sharp chisel or knife type, with flux gel and microscipe. No way of course to solder botom pads, so it will be poorly heatsinked. But I guess for a prototype you won't be driving
it full power anyway.<u></u><u></u></p>
<p style="margin:0cm;margin-bottom:.0001pt">You might also try solder paste and hot air, but IMHO that's more risky and difficult.<u></u><u></u></p>
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<p style="margin:0cm;margin-bottom:.0001pt">I'm not inUK so can't help you, although I'd gladly do it for free.<u></u><u></u></p>
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<p style="margin:0cm;margin-bottom:.0001pt">Roman <u></u><u></u></p>
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---- Użytkownik Mike Bryant napisał ----<u></u><u></u></p>
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<p class="MsoNormal">Is it possible to assemble this product by hand ?<u></u><u></u></p>
<p class="MsoNormal"> <u></u><u></u></p>
<p class="MsoNormal"><a href="https://www.infineon.com/cms/en/product/power/class-d-audio-amplifier-ic/integrated-class-d-audio-amplifier-ics/ma5332ms/?redirId=160809" target="_blank" rel="noreferrer">https://www.infineon.com/cms/en/product/power/class-d-audio-amplifier-ic/integrated-class-d-audio-amplifier-ics/ma5332ms/?redirId=160809</a><u></u><u></u></p>
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<p class="MsoNormal">I can get a PCB made at JLCPCB with all the support circuitry on it and leave plenty of space for this IC, but not sure if it’s possible to assemble this part afterwards.<u></u><u></u></p>
<p class="MsoNormal">It has a recommended stencil design in the datasheet which seems pretty tight for manual placement.<u></u><u></u></p>
<p class="MsoNormal"> <u></u><u></u></p>
<p class="MsoNormal">Alternatively anybody in the UK with whatever equipment is needed and willing to do it (paid for obviously) please email me.<u></u><u></u></p>
<p class="MsoNormal"> <u></u><u></u></p>
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