[sdiy] Can google's free* 180nm OSHW foundry be used for synth parts?

usenet at teply.info usenet at teply.info
Sun Aug 7 01:49:18 CEST 2022


On 06.08.22 23:42, cheater cheater wrote:
> Bear in mind the Google program is a shuttle program so as I
> understand it that means your design shares the wafer with other
> people's. I think that means whatever process you'll be using is
> common to all of those chips so you probably can't ask for a special
> process, but I don't know.
> 
That's the whole idea of a shuttle program or Multi-project wafer 
service: The mask set is fixed cost, regardless if you produce one 
single wafer - which no fab would even consider doing - or thousands of 
them. With the numbers Mike Bryant mentioned - which are pretty average 
by the way for a 180nm CMOS process -, up to about 40-50 wafers, mask 
cost will dominate the total wafer manufacturing price (still, backend 
manufacturing stuff like testing, dicing, packaging, comes on top 
per-piece). And, for low volumes it'll dominate total cost of 
manufacturing the chip unless you need some extra bells and whistles in 
backend.
If you intend to ship only few samples, maybe a few hundred, per design, 
it'll be most cost-efficient per design if you cram as many designs onto 
one mask set as possible and rather increase the number of wafers to 
produce the number of samples you need. Of course that only works up to 
a certain point, as scaling up the mask size has its limits based on 
*REALLY* expensive equipment - the scanner for lithography of a 180nm 
process will be the most expensive tool needed, costing approximately 
20-25 million dollars. If you need bigger masks, you'll need a scanner 
that can handle bigger masks, which become significantly more expensive, 
and the masks itself become much more expensive as well. I believe the 
masks commonly available tools and suppliers can handle are on the order 
of a couple hundred square millimetres.
Even with a 30x30mm mask area, you can cram about 300 3mm² designs - 
which is fairly big for a 180nm cmos unless you intend to copy an Intel 
Pentium III  or similar - onto one mask set and still get about 10 
complete masks per wafer. So for 100 samples per design, even 10 wafers 
would be sufficient to fulfill the need of 100 samples per design. Yet 
the foundry probably wouldn't even start production of less than 25 
wafers...

Of course they won't run a special process for anyone unless that 
customer has very deep pockets.
The parasitic bipolars I mentioned are intrinsic to the way a MOS 
transistor is formed: with source and drain being n-doped, and the body 
in between being p-doped, you intrinsically have an npn bipolar device, 
which is not normally used as such because the base-emitter junction is 
not forward biased in normal MOS operation. So the device is there, if 
you use it or not. Its just that electrically it's going to be very 
poor. Which is why nearly nobody cares about these kind of devices.

Bests,
Florian


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