[sdiy] DIP LM13700 discontinuation
Roman Sowa
modular at go2.pl
Mon May 24 10:57:43 CEST 2021
Hear, hear!
Couldn't agree with you more.
The key to soldering with paste is precision printing, and that's not
something you can do with a syringe.
Everything except BGA can be soldered manually faster and with nicer
looking joints.
Roman
W dniu 2021-05-24 o 06:45, p. hendricks via Synth-diy pisze:
> I really dread though-hole stuff now. SMT/SOIC parts are so much easier
> and faster. Building NLC modules.
> SOIC stuff is quick and easier to swap than a socketed chip.
> DON'T USE PASTE and hot air gun. that shit spreads under the chips. it's
> easy and fast too often is a mess that will fuck it up.
> Hot air is great for de-soldering. Use a proper oven for soldering.
>
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