[sdiy] IDC connector reliability?

[J. Verhoeven]

LOL, well there you go :-)

Interestingly, the second document is a 503 type which we do not use very often (internally TE Connectivity in NL), but I want to start using again (because it takes ages for the testlab to make a testreport, and this type allows us engineers to do our own testreport). Just talked to our documentation guy today about this.



On 04/03/13, Neil Johnson <neil.johnson97 at ntlworld.com> wrote:
> cheater cheater <cheater00 at gmail.com> wrote:
> > Hi Jarno,
> >
> >
> > On Wed, Apr 3, 2013 at 9:29 AM, J. Verhoeven <jarno.verhoeven at ziggo.nl> wrote:
> >> Gold plating will help with the number of matings and contact resistance,
> >
> > Not really true. Gold does not help with the number of matings, unless
> > it's PVD gold plating, in which case what helps with the number is the
> > substrate the gold is applied to.
> >
> > Gold is used to prevent oxidation when there are long periods between
> > mating cycles.
> >
> > If you want self-healing contacts, you use silver. They increase the
> > number of possible matings considerably, however you *have* to cycle
> > the connection, otherwise the surface covers in sulfides and you have
> > to clean it up. Quite often cleaning up means just mating the
> > connector a good several times until the sulfides have been scratched
> > off. For more severe cases you can mate with a steel or brass
> > connector made specifically for that purpose.
> 
> Gold: http://www.te.com/documentation/whitepapers/pdf/aurulrep.pdf
> 
> Silver: http://www.te.com/documentation/whitepapers/pdf/Ag_use_connectors_503-1016.pdf
> 
> Neil
> -- 
> Modules and more: http://www.cesyg.com
> Homepage: http://www.njohnson.co.uk
> 
>