[sdiy] Opinion poll - Through Hole ~vs~ SMT

[MTG]

What do you use for flux removal afterward (if anything)?

On 6/7/2012 11:04 AM, colin f wrote:
>
>> I'm in the USA and still have access to 60/40 solder.  I bet
>> lead-free would make my life miserable !
> Not at all.
> If you pay a little more, you can get a lead-free solder with a bit of
> silver in it, and it flows nicely enough.
> I tin all the pads first, leaving enough solder for a joint on one pad, or
> two diagonal pads for ICs.
> It's critical to use a good flux.
> I use a flux gel. I squirt a blob of it onto a little flat block, then dip
> each SMD component into the gel before placing it on the board.
> I only apply flux directly to the board for ICs.
> I melt the blob of solder on the one pad then place the component on the
> board.
> If you hold the iron tip in the right place, the surface tension in the
> melted solder will pull the component into the right position without too
> much fiddling.
> Once all components are done, I go back round and solder all the other pins.
> The only problem really is eyesight. An illuminated magnifier is a must.
> Big plusses of surface mount are the availability of parts and higher board
> densities.
> I find assembly is quicker because I'm not having to pre-form component
> legs, the board can lie flat on the bench while all the SMD components go
> on, and there is no turning the board back and forth, and snipping legs
> after soldering.
> Thru-hole is kinda tedious.
>
> Cheers,
> Colin f
>
>
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