[sdiy] Opinion poll - Through Hole ~vs~ SMT

[colin f]

> I'm in the USA and still have access to 60/40 solder.  I bet 
> lead-free would make my life miserable !

Not at all.
If you pay a little more, you can get a lead-free solder with a bit of
silver in it, and it flows nicely enough.
I tin all the pads first, leaving enough solder for a joint on one pad, or
two diagonal pads for ICs.
It's critical to use a good flux.
I use a flux gel. I squirt a blob of it onto a little flat block, then dip
each SMD component into the gel before placing it on the board.
I only apply flux directly to the board for ICs.
I melt the blob of solder on the one pad then place the component on the
board.
If you hold the iron tip in the right place, the surface tension in the
melted solder will pull the component into the right position without too
much fiddling.
Once all components are done, I go back round and solder all the other pins.
The only problem really is eyesight. An illuminated magnifier is a must.
Big plusses of surface mount are the availability of parts and higher board
densities.
I find assembly is quicker because I'm not having to pre-form component
legs, the board can lie flat on the bench while all the SMD components go
on, and there is no turning the board back and forth, and snipping legs
after soldering.
Thru-hole is kinda tedious.

Cheers,
Colin f