[sdiy] Nice info on decoupling caps

[ASSI]

On Thursday 19 January 2012, 18:27:26, dlmanley at sonic.net wrote:
> Richie, on a four layer board I've always seen power and ground on the
> internal planes with the signals on the two outer layers.  Not the other
> way round.  Where is the method you described used?

Depends on the stackup of the board (which you are free to specify, within 
reason), but usually the inner two layers are thicker than the outer two and 
hence the more natural place for the power supply planes is on the inner 
layers.  Also, you can't get at the traces on inner routings for debugging 
purposes easily and the additional vias from SMT components to an inner 
routing layer may well remove any positive effect on inductance the 
shielding might have had.

Buried routing is used when the cost of an extra shield (shell, metalized 
enclosure) is too large and radiated emissions test (one or both ways) is 
marginally failing.


Regards,
Achim.
-- 
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