[sdiy] SMD experiences

Matthew Smith matt at smiffytech.com
Fri Sep 9 08:08:22 CEST 2011


Quoth David G Dixon at 09/09/11 11:15...
> I would say, just watch out for capacitive and inductive effects,
> particularly with long high-impedance traces running in parallel with signal
> traces.  With 4-layer boards, layer-to-layer bleedthrough may become and
> issue if traces are parallel.

For the purposes of what I'm doing, the first copper layer below the top 
  is a ground plane (and I mean plane - all filled, except where there 
are vias,) the second being a power plane.

If I end up with any long signal traces, my board is too big ;-)

As regards stability caps, that's easy to factor into the design - I've 
already got power decoupling caps all over the shop, adding these to the 
design procedure just involves me writing a PostIt note to get me to 
remember to check all schematics to ensure feedback circuits have them. 
Think I should have no shortage of 22pF 0603s - that's what the clock 
crystal loading caps are on most of my microcontrollers.

If you look at the BOM for my ADSR/LFO, the vast bulk of the components 
are either decoupling caps or filter caps for the ADC inputs - stability 
caps on what few analogue parts there are will be in good company.

But 4-layer is there if I need it. Just a case of balancing the $10 per 
square inch against $5 per square inch, and the fact that I'll have the 
inconvenience of turning layers off in Eagle so that I can see where I 
am routing the middle layers ;-)


-- 
Matthew Smith

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