[sdiy] Designing Analog ICs

[ASSI]

On Wednesday 07 September 2011, David Schwan wrote:
> 4) Packaging? I have no idea what the cost is.

If you know a place that has a bonder and some ceramic packages it can be 
cheap.  Wirebonders are somewhat less scarce than some other resources you'd 
need.
 
> 5) What you likely need is a 40V bipolar process with device models.
> Preferred is 2 layers of Metal. Needs to have some form of capacitor,
> and two types of resistors, hopefully with opposite tempco's

The CEM had plenty of success without the capacitors and the resistors, with 
just a single layer of metal.

> 7) Assume versions A and B don't work. Assume that they can be tweaked
> with Metal layers only.

You'd really, really not want to do a respin on something like that.
 
> 8) You will need to write a DRC rule deck for some tool.

That would be nice, but in reality you will just have to waste a bit of area 
to keep things simple enough to do it by eyeballing the layout.  Not very 
difficult for a plain bipolar process, but it is tedious and error-prone.



Regards,
Achim.
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