[sdiy] Ground planes

[Magnus Danielson]

Ingo Debus wrote:
>
> Am 31.03.2010 um 01:55 schrieb Magnus Danielson:
>
>>  it just isn't used in the audio-realm since the need for 
>> ground-planes is almost none.
>
> But aren't HF properties important even in very low frequency circuits 
> when it comes to EMC?
Well... most of them can be handled fairly well locally where needed. We 
rarely use fast parts, so doing the 100 nF ceramic cap between the power 
pins on digital and comparators and keeping those leads short should get 
most of it. It's not like you want to support a few hundred MHz or so on 
a regular basis. It's when the more fun processor stuff occurs that some 
more attention is needed.

So, for most part doing it for HF-reasons seems a bit of an over-kill. 
Doing it to save etching seems much more reasonable to me at least. If 
someone can show me a case where it has or should have impact, then I 
would maybe look at it. I just don't want people to waste time on 
something which has little gain for them. Knowing why it may be needed 
is another thing.
> I agree desoldering from ground planes is a pain even with thermals 
> (sometimes called thermal traps). Patience is the key. 
Pre-heating is the real key. If you pre-heat it properly, then the 
actual soldering becomes much easier.

Cheers,
Magnus