[sdiy] Speaking of Vanishing OTAs

[Metrophage]

My guess is that this is certainly a factor, but the manufacturers of
electrononics components are happy about an excuse to standardize the
packages they produce. In some respects, this will make their jobs
easier. As things have been, manufacturers could not get rid of DIP and
SIP without alienating a decent portion of their clientelle. But if
everybody switches at once, this ceases to be an issue. For THEM,
anyway. 

CJ 



--- ASSI <Stromeko at compuserve.de> wrote:
> On Sonntag, 22. Mai 2005 17:52, Rainer Buchty wrote:
> > > I'd start worrying about the vanishing *DIP* package after July
> > > 2006 (RoHS requirements).
> >
> > What (chemical) difference exists between DIP/DIL and SO/QFP?
> 
> None that I know of. There are certainly different mold compounds for
> 
> different chip and package sizes, but they are not a-priori linked to
> 
> certain types of packages. The same goes for the leadframe. The real 
> reason for DIP packages vanishing due to ROHS requirements would 
> probably be the necessary package re-qualification.
> 
> 
> Achim.
> -- 
> +<[Q+ Matrix-12 WAVE#46 Neuron microQkb Andromeda XTk sonic heaven]>+
> 
> SD adaptation for Waldorf rackAttack V1.04R1:
> http://Stromeko.Synth.net/Downloads.html#WaldorfSDada
> 
> 


		
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