[sdiy] Speaking of Vanishing OTAs

[ASSI]

On Sonntag, 22. Mai 2005 17:52, Rainer Buchty wrote:
> > I'd start worrying about the vanishing *DIP* package after July
> > 2006 (RoHS requirements).
>
> What (chemical) difference exists between DIP/DIL and SO/QFP?

None that I know of. There are certainly different mold compounds for 
different chip and package sizes, but they are not a-priori linked to 
certain types of packages. The same goes for the leadframe. The real 
reason for DIP packages vanishing due to ROHS requirements would 
probably be the necessary package re-qualification.


Achim.
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