[sdiy] SDIY vs RoHS

[Paul Schreiber]

>> I'd start worrying about the vanishing *DIP* package after July 2006 (RoHS
>> requirements).
>
> What (chemical) difference exists between DIP/DIL and SO/QFP?

DIP packages contain lead (in the solder that coats the pins). SOICs started 
converting over to lead-free tin plating about 1 year ago. By the end of this 
year, all SOIC/resistors/caps/etc will be lead-free. I suppose *gold-plated 
ceramic DIPS* are exempt :)

If you look in the latest Mouser and Digikey catalog, you will see more emphasis 
placed on lead-free parts.

Technically, you can use leaded solder IF the weight of the lead component is 
below like 85% of the TOTAL weight. But regular 60-40 type solder is about 94% 
lead (by weight, not by composition).

But DIPs are not the only problem. What about the leads on resistors? Pots? 
Connectors? It gives me a headache.

Paul S.