[sdiy] Thermal contact of exponential convertor components

[allenre at umich.edu]

There has to be some kind of anti-static insulating foam I can wrap the expo
components in.  Adding an aluminum enclosure doesn't sound like much fun.  Off
to the search engine!

Ryan

> That's fine. The main purpose of course is to try and ensure that both
> components experience the same temperature affects. I would stay away from
> epoxy glues etc as Murphy's Law will dictate that you will need to remove one
> or more components at some time and this will make it all the more difficult.
> Heatshrink tubing makes a great draught insulator. On the ASM-2 I have set it
> up so that the TEMPCO can be laid underneath the MAT-02 which helps with the
> mechanics a bit.
>
> It might be worth considering the hardware layout of the VCO so that you can
> house it, or at least the TEMPCO section in an aluminium enclosure. The main
> thing would be to keep draughts away from the circuit yet try to maintain a
> stable temperature environment which would mean a well-ventilated (but
> draught free) enclosure.
>
> Best Regards
> Laurie Biddulph
> http://www.elby-designs.com
>   ----- Original Message -----
>   From: allenre at umich.edu
>   To: Laurie Biddulph
>   Sent: Monday, May 17, 2004 6:31 AM
>   Subject: Re: [sdiy] Thermal contact of exponential convertor components
>
>
>   I do want very precise tuning, so that I can use my VCOs on microtonal
> scales
>   with great accuracy.  I don't know how much of a difference it really
> makes,
>   but it might be significant for my uses.  Thanks for the info,
>
>   Ryan
>
>   > Hello Ryan,
>   >
>   > For most applications you don't really need to even bother about this. It
> is
>   > only in really critical applications that you will need the higher
>   > performance of thermally bonding the two components together. If you are
>   > going to do this then you only need a thin layer of heatsink compound
> smeared
>   > on to the two adjoining faces and then hold the two components together
> which
>   > is best done with a tie-wrap or even a piece of heatshrink.
>   >
>   > You do not need tons of heatsink compound (so goop is probably a bad
> choice
>   > of terms).
>   >
>   > Best Regards
>   > Laurie Biddulph
>   > http://www.elby-designs.com
>   >   ----- Original Message -----
>   >   From: allenre at umich.edu
>   >   To: synth-diy at dropmix.xs4all.nl
>   >   Sent: Monday, May 17, 2004 3:43 AM
>   >   Subject: [sdiy] Thermal contact of exponential convertor components
>   >
>   >
>   >   I'm gathering parts for the Rene Schmitz's VCO3, and I am wondering if
> I
>   > need to
>   >   use heat sink compound on the transistor array and tempcos, or if I can
>   > epoxy
>   >   them together.  I'm not sure of the method of applying the heat sink
>   > compound.
>   >   The ASM-1 page mentions that "The transistor ans the tempco resistors
> (if
>   > used)
>   >   should be gooped up with heatsink compound... and tie-wrapped together,
> for
>   >   best thermal result."  So, should I cover the components with the
> compound,
>   >   then use a plastic tie-wrap to hold them close?  My understanding is
> that
>   > the
>   >   heat sink compound helps to transfer heat, so I only need to apply it
>   > between
>   >   the two components (in this case, a tempco and a 2SC1583), and the
> tie-wrap
>   >   holds them together (since the compound is non-adhesive).  Is this
> correct?
>   >   Thanks,
>   >
>   >   Ryan Allen
>   >
>
>
>