ODP: DIL package disappearing? (was: CA3046 replacement)

[Karl Helmer Torvmark]

On Tue, 6 Jul 1999, Roman Sowa wrote:

> what I'm affraid of, are those BGA packages, with 'balls' on whole bottom
> surface. Now THIS will kill diying for sure.

Actually, I've heard some crazy people soldering these DIY, too. However,
this is not for the faint of heart. Your board MUST have a solder mask.
You position the IC as accuratly as possible, and use a heat gun (same as
used for heat-shrink tubing) to heat the chip. The yield will not be above
70% or so with this method, but if you're desparate....

Just goes to show that most things CAN be done, if one is persistent/crazy
enough.

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Karl H.