CA3080s

[Magnus Danielson]

>>>>> "GR" == Grant Richter <grichter at execpc.com> writes:

 >> 
 >> Once the moisture gets through the package to the chip corrosion starts 
 >> to happen and finally the chip says "pop" and smells bad. 
 >> The other problem with the old plastic CA3080 must have been that
 >> they don't have enough power consumption to keep the chips warm and dry as
 >> old TTL chips would have done.
 >> 

 GR> Let's not forget that the purity of the chemical processes used to fab the chips 
 GR> has improved dramatically in twenty years.
 GR> I've seen a lot of 741 failures inside circuits where the chip is well protected
 GR> and not stressed. The only thing I can think of is chemical impurities in the original
 GR> fab process.
 
Well, the quality of the plastic which builds the plastic surrounding
of a typhical 741 or CA3080 has improved over the years, something
that have been driven by the need of todays sharper quality needs.

The fab process should if properly controled yield a very good average
quality these days...

The quality tools they have for this industry is interesting, I just
wonder when it will hit the PC software/hardware industry... that
would be interesting... :)

I just work next to a sub-micron fab and there is a smaller one in the
building, so I haven't much of a clue...

Cheers,
Magnus