ARP

[riccardo]

Hi everybody,
very interesting at the ARP site, the page regarding how to open an
encapsulated
module.
I wonder how the epoxy resin can be dissolved so easily to let the board and
the components remain absolutely untouched.
I tried to dissolve the resin on the GX-1 submodules.
Even using vry corrosive agents (acids and basis) I have not arrived to any
result.
Seem there is no e-mail address to contact the gentleman who did it.
Anybody can help?
thks, ciao
riccardo