[sdiy] ODP: Question for the self-assembly SMD-ers here
tom at electricdruid.net
Fri Feb 18 22:18:15 CET 2022
Just as a totally random suggestion from someone who's never tried anything like this, could you put a tiny blob of thermal paste under it before you solder the outside pads? Clearly not going to be as good as a soldered connection, but it might get you closer if that was important?
> On 18 Feb 2022, at 21:06, Roman <modular at go2.pl> wrote:
> Soldering wires to QFN upside down is 10 times more difficult than soldering it to pcb using a nail heated in candle flame.
> For testing and debugging PCB just solder it around and ignore thermal pads. You will not test that at 100% power, right? Not even at 10% possibly. It shouln't even get slightly warm then.
> ---- Użytkownik Mike Bryant napisał ----
> Ø Since you plan to make slightly more than just a prototype, IMHO the best way to do it is to find a friend locally with p&p and oven, and do whole assembly there, not at JLC. Roman
> You’ve obviously got a more useful set of friends than me :-)
> But I understand what you say so it looks like I’ll just have to pay to get the thing prototyped. Before that I’ll maybe just attach the chip upside down with thermal glue on the PCB backside and run wires from large vias on the PCB to the pads.
> Won’t have the thermal handling of the final assembly but debugs the PCB first before I pay for proper assembly.
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